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Extreme ultraviolet radiation
Mahindra XUV 500
Crossover Utility Vehicle
HSV Avalanche XUV
Some news about the future of XUV:
"As has been the case for the past several years, trepidation over the development of extreme ultraviolet (XUV) lithography was one of the oft-repeated themes at this year's Semicon West fab tool tradeshow in San Francisco.
"XUV is the highest priority for our industry," said Luc Van den Hove, president and CEO of European microelectronics research institute Imec, in a panel discussion at the event.
In May, Dutch lithography vendor ASML finalized a deal to acquire lithography source vendor Cymer for about $2.6 billion. The deal is largely considered an attempt by ASML to take a firmer hand in the development of an XUV source. Cymer is one of three developers trying to create a source that would be powerful enough to support commercial production throughput of an XUV lithography tool."
"ASML develops technology for high-tech lithography machines for the semiconductor industry. The company, based in The Netherlands, manufactures equipment that is used to transfer circuit patterns onto wafers. For them and their customers, XUV, or extreme ultraviolet, is a significant term that comes down to producing wafers in a better way. The chip industry has long hoped to use the short-wavelength light to make circuits that are cheaper and denser. The company, according to IEEE Spectrum's detailed report, has announced its work with extreme ultraviolet and related goals, and that its XUV machines will by 2015 be bright enough for commercial production."
"ASML reported incremental progress on extreme ultraviolet lithography which it said will be the best option for making chips starting at the 10 nm node and below. An executive was more cautious about the outlook for 450mm wafers in an industry keynote here.
Using double patterning and other techniques, XUV can make devices at 7 and 3 nm nodes, Martin van den Brink, chief product and technology officer at ASML told EE Times after a keynote at the International Solid State Circuits Conference. “I don’t see a fundamental limit with what we have, the question is can we do it economically,” he said.
He also discussed plans for supporting commercial production of 450mm wafers in 2018 with a second generation XUV system. While Intel, Samsung and TSMC provided additional funding of 828 million euros last year for XUV work, currently Intel is the sole company funding the 450mm program, providing 553 million euros, he said."
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